TW_感測器研發_Packaging Development Engineer (MEMS products)

Responsibilities

• Define & drive milestones: Establish major package‐development milestones and ensure on-time delivery through proactive planning, progress tracking, and risk mitigation.
• Design coordination: Coordinate package design and process development for electronic MEMS sensors in collaboration with internal engineering teams and external suppliers.
• Process engineering: Develop and optimize assembly processes for MEMS in automotive and consumer-electronics applications.
• Sample build & qualification: Oversee sample manufacturing and process qualification at assembly partners.
• Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering, supply chain, and quality teams.

• Experience: 3–8 years in semiconductor packaging/assembly (LGA, BGA, DFN, WLCSP).
• Technical expertise: Strong background in semiconductor assembly technologies and materials.
• Project management: Proven ability in milestone tracking, reporting, systematic problem solving, multi-task handling and customer communication.
• Global teamwork: Demonstrated success in multicultural, international projects.
• Adaptability: Agile in adjusting project plans to evolving technical requirements and customer needs.
• Language & mobility: Excellent English skills (verbal and written); willingness to travel as required.